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Postprint: Study on Stress-Strain Relationship of Sn-Rich Phase Based on Nanoindentation Method

Liu Zhigao, Hou Bin, Liu Tianhan, Qin Hongbo, Qin Hongbo
2022-05-25 ChinaXiv: chinaxiv-202205.00164

In the field of electronic packaging, lead-free solders are primarily binary or ternary Sn-based eutectic or near-eutectic alloys, with the Sn-rich phase constituting the matrix phase. To characterize the mechanical properties and stress-strain relationship of the Sn-rich phase, nanoindentation test…