Postprint: Study on Stress-Strain Relationship of Sn-Rich Phase Based on Nanoindentation Method
In the field of electronic packaging, lead-free solders are primarily binary or ternary Sn-based eutectic or near-eutectic alloys, with the Sn-rich phase constituting the matrix phase. To characterize the mechanical properties and stress-strain relationship of the Sn-rich phase, nanoindentation test…